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T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E l e ct r i c D e v i c e Te c h n o l o g y C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n or u s e d f or the manuf acturin g purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
DATE
CHECKED APR.-07-`04
DRAWN APR.-07-`04
CHECKED APR.-07-`04
NAME
Device Name
Spec. No.
Type Name
APPROVED
PH975C6
SILICON DIODE
MS5D2078
S P E C I F I C AT I O N
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
MS5D2078 1/12
H04-004-07b
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Date
APR.-07 -2004 Classification Enactment Ind. Content
Revised
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Applied date Issued date Drawn
Records
MS5D2078
Checked
2/12
Approved
H04-004-06b
1. SCOPE This specification provides the ratings and the test requirement for FUJI SILICON DIODE PH975C6 2.APPLICATION PFC circuit(current discontinuous mode) This diode is a product which optimizes the diode characteristic for the PFC circuit.This product is a product by which th VF characteristic was valued more than trr though there is a relation of the trade-off up to VF and trr. 3. OUT VIEW, MARKING, MOLDING RESIN, CHARACTERISTICS (1)Out view is shown MS5D2078 9/12 (2)Marking is shown MS5D2078 9/12 It is marked to type name or abbreviated type name, polarity and Lot No. (3)Molding resin Epoxy resin UL : V-0 (4)Characteristics is shown MS5D2078 10/1212/12 4.LEAD AND LABEL (1)Outer lead material:Cu+Pb-Sn Solder(Dipping) Outer lead material: Cu+Sn-Cu Solder(Dipping) (2)LABEL Pb-Sn Soldering mark

T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Sn-Cu Pb Free mark

PCS
DATE CODE
PCS
DATE CODE
EIAJ C-3 MADE IN JAPAN 01 A
EIAJ C-3 MADE IN JAPAN 01 A
Pb
5. RATINGS 5.1 MAXIMUM RATINGS (at Tc=25 unless otherwise specified.) ITEM SYMBOL CONDITIONS Repetitive peak reverse voltage VRRM 50Hz Square wave duty 1/2 Average output current Io Tc=97 Non-repetitive surge current ** IFSM Sine wave, 10ms 1shot Operating junction temperature Tj
Storage temperature
* **
RATINGS 600 20 * 100 150 -40+150
UNITS V A A
Tstg
Out put current of center tap full wave connection. Rating per element 5.2 ELECTRICAL CHARACTERISTICS (at Tc=25 unless otherwise specified.) ITEM SYMBOL CONDITIONS MAXIMUM Forward voltage *** VF IF= 10A 1.55 Reverse current *** IR VR=VRRM 10.0 Reverse recovery time *** trr IF=0.1A,IR=0.2A,Irec=0.05A 50.0 Thermal resistance Rth(j-c) Junction to case 1.5 *** Rating per element 5.3 MECHANICAL CHARACTERISTICS Mounting torque Recommended torque 0.40.6 Approximate mass 4.9
DWG.NO.
UNITS V A ns /W
Nm g
Fuji Electric Device Technology Co.,Ltd.
MS5D2078
3/12
H04-004-03a
6. TEST AND INSPECTION 6.1 STANDARD TEST CONDITION Standard test condition is Ta=25RH=65%. If judgment is no doubt, the test condition is possible to test in normal condition Ta=535RH=4885% 6.2 STRUCTURE INSPECTION It inspect with eye and measure,Item3 shall be satisfied. 6.3 FORWARD AND REVERSE CHARACTERISTICS It inspect on the standard condition,Item5.2 shall be satisfied. 6.4 TEST
Test No. Test Items Testing methods and Conditions Pull force : 25N Force maintaining duration :101s Load force : 10N Number of times : 2times(90deg./time) Screwing torque value:(M3) : 5010Ncm Frequency : 100Hz to 2kHz Acceleration : 100m/s2 Sweeping time : 4min./1 cycle 4times for each X, Y&Z directions. Peak amplitude : 15km/s2 Duration time : 0.5ms 3times for each X, Y&Z directions. Solder : Sn-37Pb Solder temp. : 2355 Immersion time : 50.5s Apply to flux Solder : Sn-3Ag-0.5Cu Solder temp. : 2455 Immersion time : 50.5s Apply to flux Solder temp. : 2605C Immersion time : 101s Number of times : 1times Reference Standard EIAJ ED4701 A-111A method 1 A-111A method 3 A-112 method 2 A-121 Sampling number Acceptance number
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
1 Terminal Strength (Tensile) 2 Terminal Strength (Bending) 3 Mounting Strength 4 Vibration Mechanical test
5
5 5
5
5 Shock
A-122 test code D
5
(0 : 1)
6 Solder ability 1
5 A-131A test code A 5
Solder ability 2
7 Resistance to Soldering Heat
A-132
5
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
4/12
H04-004-03a
Test No.
Test Items
Testing methods and Conditions Temperature :stg max Test duration : 1000h Temperature :stg min Test duration : 1000h Temperature : 852C Relative humidity : 855% Test duration : 1000h Temperature : 852C Relative humidity : 855% Bias Voltage : VRRMx 0.8 Test duration : 1000h Temperature : 1302C Relative humidity : 855% Vapor pressure : 230kPa Test duration : 48h High temp. side : Tstg max Room temp. : 535 Low temp. side : Tstg min Duration time : HT 30min,RT 5min LT 30min Number of cycles : 100 cycles Fluid : pure water(running water) High temp. side : 100+0/-5C Low temp. side : 0+5/-0C Duration time : HT 5min,LT 5min Number of cycles : 100 cycles Ta=255C Rated load Test duration : 1000h Tj=Tjmax 50 3min ON, 3min OFF Test duration : 10000cy Temperature : Ta=100 C Bias Voltage : VR=VRRM duty=1/2 Test duration : 1000h
Reference Standard EIAJ ED4701 B-111A B-112A B-121A test code C B-122A test code C
Sampling number
Acceptance number
1 High Temp. Storage 2 Low Temp. Storage 3 Temperature Humidity Storage 4 Temperature Humidity Bias 5 Unsaturated Pressurized Vapor
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
22 22 22
22
B-123A test code B
22
Endurance test
6 Temperature Cycle
B-131A
22
(0 : 1)
7 Thermal Shock
B-141A test code A
22
8 Steady state Operating life 9 Intermittent Operating life 10 High Temp. Reverse Bias
D-402
22
D-403
22
D-404
22
Failure Criteria
IR USL x 5 VFUSL x 1.1
USL : Upper specification Limit
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
5/12
H04-004-03a
7.Cautions Although Fuji Electric is continually improving product quality and reliability, a small percentage of semiconductor products may become faulty. When using Fuji Electric semiconductor products in your equipment, you are requested to take adequate safety measures to prevent the equipment from causing physical injury, fire, or other problem in case any of the products fail. It is recommended to make your design fail-safe, flame retardant, and free of malfunction. The products described in this specification are intended for use in the following electronic and electrical equipment which has normal reliability requirements. Computers OA equipment Measurement equipment Electrical home appliances Communications equipment (Terminal devices) Machine tools Personal equipment AV equipment Industrial robots etc.
The products described in this Specification are not designed or manufactured to be used in equipment or systems used under life-threatening situations. If you are considering using these products in the equipment listed below, first check the system construction and required reliability, and take adequate safety measures such as a backup system to prevent the equipment from malfunctioning.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Transportation equipment (automobiles, trains, ships, etc.) Backbone network equipment Gas alarms, leakage gas auto breakers Burglar alarms, fire alarms, emergency equipment Nuclear control equipment etc. Do not use the products in this Specification for equipment requiring strict reliability such as (but not limited to): Aerospace equipment Aeronautical equipment 8.Warnings The Diodes should be used in products within their absolute maximum rating (voltage, current, temperature, etc. ). The diodes may be destroyed if used beyond the rating. The equipment containing Diodes should have adequate fuses or circuit breakers to prevent the equipment from causing secondary destruction (ex. fire, explosion etc...). Use the Diodes within their reliability and lifetime under certain environments or conditions. The Diodes may fail before the target lifetime of your products if used under certain reliability conditions. You must design the Diodes to be operated within the specified maximum ratings (voltage, current, temperature, etc. ) to prevent possible failure or destruction of devices. Consider the possible temperature rise not only for the junction and case, but also for the outer leads. Do not directly touch the leads or package of the Diodes while power is supplied or during operation, to avoid electric shock and burns. The Diodes are made of incombustible material. However, if a Diode fails, it may emit smoke of flame. Also, operating the Diodes near any flammable place or material may cause the Diodes to emit smoke or flame in case the Diodes become even hotter during operation. Design the arrangement to prevent the spread of fire. The Diodes should not used in an environment in the presence of acid, organic matter, or corrosive gas. (hydrogen sulfide, sulfurous acid gas.) The Diodes should not used in an irradiated field since they are not radiation proof. Traffic-signal control equipment Submarine repeater equipment Medical equipment
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
6/12
H04-004-03a
Installation Soldering involves temperatures which exceed the device storage temperature rating. To avoid device damage and to ensure reliability, observe the following guidelines from the quality assurance standard. Table 1: Solder temperature and duration Solder Method Duration temperature Flow 2605 101second Soldering iron 35010 3.00.5second The immersion depth of the lead should basically be up to the lead stopper and the distance should be a maximum of 1.5mm from the device. When flow-soldering, be careful to avoid immersing the package in the solder bath. Refer to the following torque reference When mounting the device on a heat sink. Excess torque applied to the mounting screw causes damage to the device and weak torque will increase the thermal resistance, both of which conditions may destroy the device.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Table 2:Recommended tightening torque Package style Screw Recommended tightening torque TO-247 M3 0.40.6Nm The heat sink should have a flatness within 30 and roughness within 10 Also, keep the m m. tightening torque within the limits of this specification. Improper handling may cause isolation breakdown leading to a critical accident. We recommend the use of thermal compound to optimize the efficiency of heat radiation. It is important to evenly apply the compound and to eliminate any air voids. Storage The Diodes must be stored at a standard temperature of 5 to 35 and relative humidity of 45 to 75%.If the storage area is very dry, a humidifier may be required. In such a case, use only deionized water or boiled water, since the chlorine in tap water may corrode the leads. The Diodes should not be subjected to rapid changes in temperature to avoid condensation on the surface of the Diodes. Therefore, store the Diodes in a place where the temperature is steady. The Diodes should not be stored on top of each other, since this may cause excessive external force on the case. The Diodes should not be stored with the lead terminals remaining unprocessed. Rust may cause presoldered connections to go fail during later processing. The Diodes should be stored in antistatic containers or shipping bags.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
7/12
H04-004-03a
9.Appendix This products does not contain PBBs (Polybrominated Biphenyl) or PBDEs (Polybrominated Diphenyl Ether ) , substances. This products does not contain Class-I ODS and Class-II ODS substances set force by `Clean Air Act of US' law.
If you have any questions about any part of this Specification, please contact Fuji Electric or its sales agent before using the product Neither Fuji nor its agents shall be held liable for any injury caused by using the products not in accordance with the instructions. The application examples described in this specification are merely typical uses of Fuji Electric products. This specification does not confer any industrial property rights or other rights, nor constitute a license for such rights.
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
8/12
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
See Note:1
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
Note:1.Country of origin mark. No mark is Made in JAPAN. Pis Made in PHILIPPINES.
MS5D2078
9/12
H04-004-03a
Forward Characteristic (typ.)
101
Reverse Characteristic (typ.)
Tj=150C
Tj=125C
100
Tj=100C
10
Tj=150C
IF Forward Current (A)
Tj=125C Tj=100C Tj=25C
IR Reverse Current (A)
10-1
10-2
Tj=25C
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
10-3
1
10-4
0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
0
100
200
300
400
500
600
700
VF Forward Voltage (V)
VR Reverse Voltage (V)
Forward Power Dissipation (max.)
25 0.015 0.014 0.013 20 0.012 0.011
Reverse Power Dissipation (max.)
DC
Forward Power Dissipation
(W)
(W)
15
0.010 0.009 0.008 0.007 0.006 0.005 0.004
Square wave =120 Sine wave =180 Square wave =180 10
Reverse Power Dissipation
Square wave =60
=180
DC
5
PR
0.003 0.002 0.001 0.000 0 2 4 6 8 10 0 100 200 300 400 500 600 700 Per 1element 0
WF
Io
Average Output Current
(A)
VR
Reverse Voltage
(V)
Fuji Electric Device Technology Co.,Ltd.
DWG.NO.
MS5D2078
10/12
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
IFSM Tc
100 110 120 130 140 150 50 60 70 80 90
Peak Half - Wave Current Case Temperature (C)
1000 100
(A)
10
160
1 0 2 4 6 8
1
Io
10 12
10 14 16 18 20
:Conduction angle of forward current for each rectifier element
Io:Output current of center-tap full wave connection
Current Derating (Io-Tc) (max.)
Surge Capability (max.)
Number of Cycles at 50Hz Average Output Current
Square wave =60
(A)
Square wave =120 22 24 26
DC
Sine wave =180
Square wave =180
100 28
DWG.NO.
1
Fuji Electric Device Technology Co.,Ltd.
(A)
1000 1
IFSM
100
Peak Half - Wave Current
Cj
10
Junction Capacitance (pF)
1000 100
10 10
1
VR
10
t Time
(ms)
Junction Capacitance Characteristic (typ.)
MS5D2078
Surge Current Ratings (max.)
100
Reverse Voltage (V)
100
Sine wave
11/12
1000
1000
H04-004-03a
T h i s m a t e r i a l a n d t h e i n f o r m a t i o n h e r e i n i s t h e p r o p e r t y o f Fu ji E le c t r ic D e v i c e Te c h n o l o gy C o . , L t d . T h e y s h a l l b e n e i t h e r r e p r o d u c e d , c o p i e d , l e n t , o r d i s c l o s e d i n a n y w a y w h a t s o e v e r f o r t h e u s e o f a n y t h ird p a rt y n o r u s e d for the manufacturing purposes without the express written consent of Fuji Electric Device Technology Co.,Ltd.
Transient Thermal Impedance
10 10
0 -2 -1
(C/W)
10
10
1
10
-3
10
-2
10
-1
t Time
Transient Thermal Impedance (max.)
Rth j-c:1.5/W
DWG.NO.
Fuji Electric Device Technology Co.,Ltd.
(sec)
10
0
10
1
MS5D2078
10
2
12/12
H04-004-03a

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